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Center for Research and Specialized Technology in micro and nanotechnologies.

Leti (english)

innovation for industry

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  • Scientific report of 2026: Excellence in reserarch for 80 years!

    ​Download the 2026 scientific report! ​

    Scientific report of 2026: Excellence in reserarch for 80 years!
  • CEA-Leti Presents Die-to-Wafer Hybrid Bonding At 1 μm Pitch, Removing Bottleneck for AI Hardware

    ​Read the press release! ​

    CEA-Leti Presents Die-to-Wafer Hybrid Bonding At 1 μm Pitch, Removing Bottleneck for AI Hardware
  • ​​​​​RESOLVE​, a Strategic Initiative Shaping the Future of High-Value-Added Electronic Products in Europe

    ​Read the press release! ​

    ​​​​​RESOLVE​, a Strategic Initiative Shaping the Future of High-Value-Added Electronic Products in Europe

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  •    CEA spin-off Lynred launches a new cleanroom CEA spin-off Lynred launches a new cleanroom
  •    ​Brain-Computer Interface: A New Era for Post-Stroke Rehabilitation ​Brain-Computer Interface: A New Era for Post-Stroke Rehabilitation
  •    CEA-Leti Presents Die-to-Wafer Hybrid Bonding At 1 μm Pitch, Removing Bottleneck for AI Hardware CEA-Leti Presents Die-to-Wafer Hybrid Bonding At 1 μm Pitch, Removing Bottleneck for AI Hardware
  •    RESOLVE, a Strategic Initiative Shaping the Future of High-Value-Added Electronic Products in Europe RESOLVE, a Strategic Initiative Shaping the Future of High-Value-Added Electronic Products in Europe

Events

  • plasma etch and strip processes for micro-, nano- and bio-technologies
    8 June 2026 plasma etch and strip processes for micro-, nano- and bio-technologies

    The workshop gathers scientists, engineers and industry partners to discuss advances and challenges in dry etching, plasma processing and related technologies for semiconductor, MEMS and emerging applications.

  • PCIM
    9 June 2026 PCIM

    We’re excited to welcome you back to PCIM! Join us to discover our latest innovations through live demonstrations, including:- Ultra thin power converter based on piezoelectric storage,- Smart multilevel converter utilizing flying capacitor topology- High Power multilevel GaN DCDC converter for fuel cell to battery voltages adaptation- Predictive maintenance on power electronic based on non invasive sensors.Focus will be put on CEA Wide Band Gap roadmap and technologies to address high demand and challenges on power supplies. It addresses different applications from data center to drones going through automotive, aeronautic, spatial, medical.

  • LID World Summit 2026
    23 June 2026 LID World Summit 2026

    LID World Summit from 23 to 25 June offer you a front-row seat to our most recent advances. Join more than 1,250 semiconductor industry professionals at this three-day global event and come away equipped and inspired to innovate!​

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Alternative and Atomic Energies Agency

CEA is a French government-funded technological research organisation in four main areas: low-carbon energies, defense and security, information technologies and health technologies. A prominent player in the European Research Area, it is involved in setting up collaborative projects with many partners around the world.

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