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CEA-Leti will present three papers at CHES, the leading conference on cryptography and cybersecurity for embedded devices as well as a paper at a satellite conference focused on fault injection attacks.
Join us in Calgary, Canada, October 25–29, 2026, for the 250th ECS Meeting a historic celebration of science, innovation, and community. This milestone event brings together researchers, engineers, and leaders from around the world to exchange ideas, foster collaboration, and shape the future of electrochemical and solid-state science. Through world-class presentations, panels, poster sessions, and exhibits, the meeting celebrates ECS’s legacy while inspiring the next generation of clean-energy, sustainable-technology, and materials breakthroughs.
Physical AI begins with sensing. As AI moves into the physical world, application-specific sensors are becoming essential for enabling efficient, reliable, and scalable systems. This year the MEMS & Imaging Summit explores how sensor innovation, semiconductor technologies, and advanced manufacturing are shaping the next generation of Physical AI. From custom sensor design to system integration, industry experts will discuss how purpose-built sensing solutions are driving practical applications across medical, manufacturing and consumer applications.
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CEA is a French government-funded technological research organisation in four main areas: low-carbon energies, defense and security, information technologies and health technologies. A prominent player in the European Research Area, it is involved in setting up collaborative projects with many partners around the world.