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innovation for industry
CEA-Leti Announces Launch of FAMES Pilot Line As Part of EU Chips Act Initiative
Organoids on Microfluidic Chip
The 10th IEEE Electronics System-Integration Technology Conference will be taking place in Berlin from September 11-13, 2024. IEEE ESTC is the premier international event in the field of electronics packaging and system integration and the IEEE EPS flagship conference in Europe, co-sponsored by IMAPS Europe. CEA-Leti will present 3 papers on its latest developments in microelectronics packaging & 3D at ESTC conference.
After a great Eurodisplay 2022 in Stuttgart, Germany, we are happy to inform you that Eurodisplay 2024 will take place from September 18-20, 2024 in Grenoble, France, located in the heart of the Alps and also known as “Display Valley“.
Come and discover CEA-Leti's latest results in the field of 6G: scientific advances through 10 publications/presentations and one demonstrator on our stand 1003B
Discover our market solutions synonymous with competitiveness.
Visit the website of our annual event.
Get to the heart of our technologies by viewing our videos.
CEA is a French government-funded technological research organisation in four main areas: low-carbon energies, defense and security, information technologies and health technologies. A prominent player in the European Research Area, it is involved in setting up collaborative projects with many partners around the world.