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Download CEA-Leti’s 2023 Highlights
CEA-Leti Announces Launch of FAMES Pilot Line As Part of EU Chips Act Initiative
The embedded world Exhibition&Conference provides a global platform and a place to meet for the entire embedded community, including leading experts, key players and industry associations. It offers unprecedented insight into the world of embedded systems, from components and modules to operating systems, hardware and software design, M2M communication, services, and various issues related to complex system design.
The FAMES Pilot Line provides chipmakers, startups, fabless companies and academics with a pathway to high-performance, low-power chips. Find out how to access, explore and train on advanced FD-SOI technologies, embedded non-volatile memories, 3D integration, RF components, and power management integrated circuit solutions.
oin CEA-Leti CEO Sébastien Dauvé and a panel of tech experts at Leti Innovation Day Taiwan in Hsinchu on April 9, 2024 Global semiconductor R&D leader CEA-Leti is bridging the gap between lab and fab as the partner of choice for innovative businesses seeking a one-stop-shop for their advanced technology R&D needs. CEA-Leti R&D partners benefit from the institute’s state-of-the-art R&D facilities and proven technology transfer program. Don’t miss this opportunity to meet with CEA-Leti and partners and explore the potential for R&D partnerships in Taiwan. This event is organized in collaboration with SEMI and the French Office in Taipei, which is the official representation of France in Taiwan and is strongly involved to foster cooperation in all fields, including semiconductors.
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CEA is a French government-funded technological research organisation in four main areas: low-carbon energies, defense and security, information technologies and health technologies. A prominent player in the European Research Area, it is involved in setting up collaborative projects with many partners around the world.
